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SM320F28335-EP

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C2000™ Enhanced Product 32-bit MCU with 150 MIPS, FPU, 512 KB Flash, EMIF, 12b ADC

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SM320F28335-EP

ACTIVE
Data sheet Order now

Product details

CPU 1 C28 Frequency (MHz) 150 Flash memory (kByte) 512 RAM (kByte) 68 ADC type 12-bit Total processing (MIPS) 150 Features FPU32 UART 3 CAN (#) 2 Sigma-delta filter 0 PWM (Ch) 12 Security Secure storage Number of ADC channels 16 Direct memory access (Ch) 6 SPI 1 QEP 2 USB No Hardware accelerators Floating point unit Edge AI enabled Yes Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product Communication interface CAN, I2C, SPI, UART Operating system BareMetal (No OS), FreeRTOS, SafeRTOS Nonvolatile memory (kByte) 512 Number of GPIOs 88
CPU 1 C28 Frequency (MHz) 150 Flash memory (kByte) 512 RAM (kByte) 68 ADC type 12-bit Total processing (MIPS) 150 Features FPU32 UART 3 CAN (#) 2 Sigma-delta filter 0 PWM (Ch) 12 Security Secure storage Number of ADC channels 16 Direct memory access (Ch) 6 SPI 1 QEP 2 USB No Hardware accelerators Floating point unit Edge AI enabled Yes Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product Communication interface CAN, I2C, SPI, UART Operating system BareMetal (No OS), FreeRTOS, SafeRTOS Nonvolatile memory (kByte) 512 Number of GPIOs 88
PBGA (GJZ) 176 225 mm² (15 mm × 15 mm) HLQFP (PTP) 176 676 mm² (26 mm × 26 mm)
  • High-Performance Static CMOS Technology
    • Up to 150 MHz (6.67-ns Cycle Time)
    • 1.9-V/1.8-V Core, 3.3-V I/O Design
  • High-Performance 32-Bit CPU
    • IEEE-754 Single-Precision Floating-Point Unit (FPU)
    • 16 x 16 and 32 x 32 MAC Operations
    • 16 x 16 Dual MAC
    • Harvard Bus Architecture
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • Code-Efficient (in C/C++ and Assembly)
  • Six Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
  • 16-bit or 32-bit External Interface (XINTF)
    • Over 2M x 16 Address Reach
  • On-Chip Memory
    • 256K x 16 Flash, 34K x 16 SARAM
    • 1K x 16 OTP ROM
  • Boot ROM (8K x 16)
    • With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)
    • Standard Math Tables
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Watchdog Timer Module
  • GPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core Interrupts
  • Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts
  • 128-Bit Security Key/Lock
    • Protects Flash/OTP/RAM Blocks
    • Prevents Firmware Reverse Engineering
  • Enhanced Control Peripherals
    • Up to 18 PWM Outputs
    • Up to 6 HRPWM Outputs With 150 ps MEP Resolution
    • Up to 6 Event Capture Inputs
    • Up to 2 Quadrature Encoder Interfaces
    • Up to 8 32-bit/Nine 16-bit Timers
  • Three 32-Bit CPU Timers
  • Serial Port Peripherals
    • Up to 2 CAN Modules
    • Up to 3 SCI (UART) Modules
    • Up to 2 McBSP Modules (Configurable as SPI)
    • One SPI Module
    • One Inter-Integrated-Circuit (I2C) Bus
  • 12-Bit ADC, 16 Channels
    • 80-ns Conversion Rate
    • 2 x 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Internal or External Reference
  • Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
  • JTAG Boundary Scan Support(1)
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Development Support Includes
    • ANSI C/C++ Compiler/Assembler/Linker
    • Code Composer Studio IDE
    • DSP/BIOS
    • Digital Motor Control and Digital Power Software Libraries
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • Package Options
    • Quad Flatpack With Power-Pad (PTP)
    • Thin Quad Flatpack (PGF, Preview Only)
    • MicroStar BGA (GHH)
    • Plastic BGA (GJZ)
  • Temperature Options:
    • A: –40°C to 85°C (GHH) (PGF, GJZ, Preview Only)
    • S: –40°C to 125°C (GJZ, Preview Only)
    • Q: –40°C to 125°C (GJZ, Preview Only)
    • M: –55°C to 125°C (PTP, GJZ)
  • APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Military (–55°C/125°C) Temperature Range
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
  • SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Military (–55°C/125°C) Temperature Range(2)
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

(1) IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
(2) Additional temperature ranges are available - contact factory
  • High-Performance Static CMOS Technology
    • Up to 150 MHz (6.67-ns Cycle Time)
    • 1.9-V/1.8-V Core, 3.3-V I/O Design
  • High-Performance 32-Bit CPU
    • IEEE-754 Single-Precision Floating-Point Unit (FPU)
    • 16 x 16 and 32 x 32 MAC Operations
    • 16 x 16 Dual MAC
    • Harvard Bus Architecture
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • Code-Efficient (in C/C++ and Assembly)
  • Six Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
  • 16-bit or 32-bit External Interface (XINTF)
    • Over 2M x 16 Address Reach
  • On-Chip Memory
    • 256K x 16 Flash, 34K x 16 SARAM
    • 1K x 16 OTP ROM
  • Boot ROM (8K x 16)
    • With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)
    • Standard Math Tables
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Watchdog Timer Module
  • GPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core Interrupts
  • Peripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts
  • 128-Bit Security Key/Lock
    • Protects Flash/OTP/RAM Blocks
    • Prevents Firmware Reverse Engineering
  • Enhanced Control Peripherals
    • Up to 18 PWM Outputs
    • Up to 6 HRPWM Outputs With 150 ps MEP Resolution
    • Up to 6 Event Capture Inputs
    • Up to 2 Quadrature Encoder Interfaces
    • Up to 8 32-bit/Nine 16-bit Timers
  • Three 32-Bit CPU Timers
  • Serial Port Peripherals
    • Up to 2 CAN Modules
    • Up to 3 SCI (UART) Modules
    • Up to 2 McBSP Modules (Configurable as SPI)
    • One SPI Module
    • One Inter-Integrated-Circuit (I2C) Bus
  • 12-Bit ADC, 16 Channels
    • 80-ns Conversion Rate
    • 2 x 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Internal or External Reference
  • Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
  • JTAG Boundary Scan Support(1)
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Development Support Includes
    • ANSI C/C++ Compiler/Assembler/Linker
    • Code Composer Studio IDE
    • DSP/BIOS
    • Digital Motor Control and Digital Power Software Libraries
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • Package Options
    • Quad Flatpack With Power-Pad (PTP)
    • Thin Quad Flatpack (PGF, Preview Only)
    • MicroStar BGA (GHH)
    • Plastic BGA (GJZ)
  • Temperature Options:
    • A: –40°C to 85°C (GHH) (PGF, GJZ, Preview Only)
    • S: –40°C to 125°C (GJZ, Preview Only)
    • Q: –40°C to 125°C (GJZ, Preview Only)
    • M: –55°C to 125°C (PTP, GJZ)
  • APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Military (–55°C/125°C) Temperature Range
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
  • SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Military (–55°C/125°C) Temperature Range(2)
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

(1) IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
(2) Additional temperature ranges are available - contact factory

The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.

Throughout this document, the device is abbreviated as F28335. provides a summary of features.

The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.

Throughout this document, the device is abbreviated as F28335. provides a summary of features.
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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet Digital Signal Controller (DSC) datasheet (Rev. D) May 2, 2012
* User guide TMS320C28x Extended Instruction Sets Technical Reference Manual (Rev. C) Oct 29, 2019
* Errata TMS320F2833x, TMS320F2823x Real-Time MCUs Silicon Errata (Rev. N) PDF | HTML Apr 11, 2022
* Radiation & reliability report SM320F28335-EP Reliability Report (Rev. A) Jun 11, 2018
* VID SM320F28335-EP VID V6209624 Jun 21, 2016
User guide C2000 Real-Time Control Peripheral Reference Guide (Rev. V) PDF | HTML Jul 6, 2026
User guide TMS320C28x Assembly Language Tools v25.11.0.LTS User's Guide (Rev. AA) PDF | HTML Mar 25, 2026
User guide TMS320C28x Optimizing C/C++ Compiler v25.11.0.LTS User's Guide (Rev. AA) PDF | HTML Mar 25, 2026
Application note Serial Flash Programming of C2000 Microcontrollers (Rev. I) PDF | HTML Aug 14, 2025
User guide TMS320C28x DSP CPU and Instruction Set (Rev. F) Apr 10, 2015
User guide TMS320C28x Floating Point Unit and Instruction Set Reference Guide (Rev. B) Jan 23, 2014
User guide TMS320C28x DSP/BIOS 5.x Application Programming Interface (API) Reference Guide (Rev. L) Oct 9, 2012

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

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The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

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Debug probe

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB & Ethernet Debug Probe

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

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Application software & framework

DESIGNDRIVE — C2000 DesignDRIVE Software for Industrial Drives and Motor Control

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Driver or library

CONTROLSUITE — controlSUITE™ Software Suite: Software and Development Tools for C2000™ Microcontrollers

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Driver or library

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Firmware

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The SecIC-HSM is designed to meet the cybersecurity requirements needed for MCU/SoC chips. The HSM firmware can be applied in fields such as automobiles, new energy, photovoltaics, robotics, healthcare, and aviation. The provided cybersecurity functions available include secure boot, secure (...)

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Firmware

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Simulation model

F28335 PGF BSDL Model

SPRM274.ZIP (4 KB) - BSDL model
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F28335 PGF IBIS Model

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F28335 PTP BSDL Model

SPRM469.ZIP (4 KB) - BSDL model
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F28335 PTP IBIS Model

SPRM471.ZIP (203 KB) - IBIS model
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F28335 ZHH BSDL Model

SPRM275.ZIP (4 KB) - BSDL model
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F28335 ZHH IBIS Model

SPRM302.ZIP (204 KB) - IBIS model
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F28335 ZJZ BSDL Model

SPRM380.ZIP (4 KB) - BSDL model
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F28335 ZJZ IBIS Model (Rev. A)

SPRM304 (971 KB) - IBIS model
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Design tool

C2000-3P-SEARCH — C2000 Third-party search tool

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Package Pins CAD symbols, footprints & 3D models
PBGA (GJZ) 176 Ultra Librarian
HLQFP (PTP) 176 Ultra Librarian
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