The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.
The MSP430 ULP FRAM portfolio consists of a diverse set of devices that feature FRAM, the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP architecture showcases seven low-power modes, which are optimized to achieve extended battery life in energy-challenged applications.
As a high reliability enhanced product, with controlled baseline, extended temperature range (–55°C to 95°C) and gold bond wires in the package, this device is uniquely suited to mission critical applications.
(1)RTC is clocked by a 3.7-pF crystal.
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|Part number||Order||Features||Non-volatile memory (kB)||RAM (KB)||ADC||ADC: channels (#)||GPIO pins (#)||I2C||SPI||UART||Package Group||Approx. price (US$)||USB||Timers - 16-bit||Bootloader (BSL)||Special I/O||Operating temperature range (C)||Package size: mm2:W x L (PKG)||Rating|
|128||2||12-bit SAR||12||48||2||4||2||VQFN | 64||13.05 | 1ku||No||5||UART||-55 to 95||64VQFN: 81 mm2: 9 x 9 (VQFN | 64)||HiRel Enhanced Product|
|MSP430FR5739-EP||Samples not available||
|16||1||10-bit SAR||12||32||1||3||2||VQFN | 40||3.86 | 1ku||No||5||UART||-55 to 85||40VQFN: 36 mm2: 6 x 6 (VQFN | 40)||HiRel Enhanced Product|