The MSP430™ ultra-low-power (ULP) FRAM platform
combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing
innovators to increase performance at lowered energy budgets. FRAM technology combines the speed,
flexibility, and endurance of SRAM with the stability and reliability of flash at much lower
power.
The MSP430 ULP FRAM portfolio consists of a diverse set of devices that feature FRAM,
the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP
architecture showcases seven low-power modes, which are optimized to achieve extended battery life
in energy-challenged applications.
As a high reliability enhanced product, with controlled baseline, extended temperature
range (–55°C to 95°C) and gold bond wires in the package, this device is uniquely suited to mission
critical applications.
The MSP430™ ultra-low-power (ULP) FRAM platform
combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing
innovators to increase performance at lowered energy budgets. FRAM technology combines the speed,
flexibility, and endurance of SRAM with the stability and reliability of flash at much lower
power.
The MSP430 ULP FRAM portfolio consists of a diverse set of devices that feature FRAM,
the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP
architecture showcases seven low-power modes, which are optimized to achieve extended battery life
in energy-challenged applications.
As a high reliability enhanced product, with controlled baseline, extended temperature
range (–55°C to 95°C) and gold bond wires in the package, this device is uniquely suited to mission
critical applications.