Product details

Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 300, 600, 800 Coprocessors PRU-ICSS CPU 32-bit Display type 1 LCD Protocols EtherNet/IP, Ethernet, Profibus, Profinet, Sercos Ethernet MAC 2-Port 10/100 PRU EMAC, 2-Port 1Gb switch Hardware accelerators PRU-ICSS, Security Accelerator Features General purpose Operating system Linux, RTOS Security Cryptography, Device identity Rating Catalog Power supply solution TPS65216, TPS65218D0 Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 300, 600, 800 Coprocessors PRU-ICSS CPU 32-bit Display type 1 LCD Protocols EtherNet/IP, Ethernet, Profibus, Profinet, Sercos Ethernet MAC 2-Port 10/100 PRU EMAC, 2-Port 1Gb switch Hardware accelerators PRU-ICSS, Security Accelerator Features General purpose Operating system Linux, RTOS Security Cryptography, Device identity Rating Catalog Power supply solution TPS65216, TPS65218D0 Operating temperature range (°C) -40 to 105
NFBGA (ZCE) 298 169 mm² 13 x 13 NFBGA (ZCZ) 324 225 mm² 15 x 15
  • Up to 1-GHz Sitara™ ARM® Cortex®-A8 32‑Bit RISC Processor
    • NEON™ SIMD Coprocessor
    • 32KB of L1 Instruction and 32KB of Data Cache With Single-Error Detection (Parity)
    • 256KB of L2 Cache With Error Correcting Code (ECC)
    • 176KB of On-Chip Boot ROM
    • 64KB of Dedicated RAM
    • Emulation and Debug - JTAG
    • Interrupt Controller (up to 128 Interrupt Requests)
  • On-Chip Memory (Shared L3 RAM)
    • 64KB of General-Purpose On-Chip Memory Controller (OCMC) RAM
    • Accessible to All Masters
    • Supports Retention for Fast Wakeup
  • External Memory Interfaces (EMIF)
    • mDDR(LPDDR), DDR2, DDR3, DDR3L Controller:
      • mDDR: 200-MHz Clock (400-MHz Data Rate)
      • DDR2: 266-MHz Clock (532-MHz Data Rate)
      • DDR3: 400-MHz Clock (800-MHz Data Rate)
      • DDR3L: 400-MHz Clock (800-MHz Data Rate)
      • 16-Bit Data Bus
      • 1GB of Total Addressable Space
      • Supports One x16 or Two x8 Memory Device Configurations
    • General-Purpose Memory Controller (GPMC)
      • Flexible 8-Bit and 16-Bit Asynchronous Memory Interface With up to Seven Chip Selects (NAND, NOR, Muxed-NOR, SRAM)
      • Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
      • Uses Hamming Code to Support 1-Bit ECC
    • Error Locator Module (ELM)
      • Used in Conjunction With the GPMC to Locate Addresses of Data Errors from Syndrome Polynomials Generated Using a BCH Algorithm
      • Supports 4-, 8-, and 16-Bit per 512-Byte Block Error Location Based on BCH Algorithms
  • Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
    • Supports Protocols such as EtherCAT®, PROFIBUS, PROFINET, EtherNet/IP™, and More
    • Two Programmable Real-Time Units (PRUs)
      • 32-Bit Load/Store RISC Processor Capable of Running at 200 MHz
      • 8KB of Instruction RAM With Single-Error Detection (Parity)
      • 8KB of Data RAM With Single-Error Detection (Parity)
      • Single-Cycle 32-Bit Multiplier With 64-Bit Accumulator
      • Enhanced GPIO Module Provides Shift-In/Out Support and Parallel Latch on External Signal
    • 12KB of Shared RAM With Single-Error Detection (Parity)
    • Three 120-Byte Register Banks Accessible by Each PRU
    • Interrupt Controller (INTC) for Handling System Input Events
    • Local Interconnect Bus for Connecting Internal and External Masters to the Resources Inside the PRU-ICSS
    • Peripherals Inside the PRU-ICSS:
      • One UART Port With Flow Control Pins, Supports up to 12 Mbps
      • One Enhanced Capture (eCAP) Module
      • Two MII Ethernet Ports that Support Industrial Ethernet, such as EtherCAT
      • One MDIO Port
  • Power, Reset, and Clock Management (PRCM) Module
    • Controls the Entry and Exit of Stand-By and Deep-Sleep Modes
    • Responsible for Sleep Sequencing, Power Domain Switch-Off Sequencing, Wake-Up Sequencing, and Power Domain Switch-On Sequencing
    • Clocks
      • Integrated 15- to 35-MHz High-Frequency Oscillator Used to Generate a Reference Clock for Various System and Peripheral Clocks
      • Supports Individual Clock Enable and Disable Control for Subsystems and Peripherals to Facilitate Reduced Power Consumption
      • Five ADPLLs to Generate System Clocks (MPU Subsystem, DDR Interface, USB and Peripherals [MMC and SD, UART, SPI, I2C], L3, L4, Ethernet, GFX [SGX530], LCD Pixel Clock)
    • Power
      • Two Nonswitchable Power Domains (Real-Time Clock [RTC], Wake-Up Logic [WAKEUP])
      • Three Switchable Power Domains (MPU Subsystem [MPU], SGX530 [GFX], Peripherals and Infrastructure [PER])
      • Implements SmartReflex™ Class 2B for Core Voltage Scaling Based On Die Temperature, Process Variation, and Performance (Adaptive Voltage Scaling [AVS])
      • Dynamic Voltage Frequency Scaling (DVFS)
  • Real-Time Clock (RTC)
    • Real-Time Date (Day-Month-Year-Day of Week) and Time (Hours-Minutes-Seconds) Information
    • Internal 32.768-kHz Oscillator, RTC Logic and 1.1-V Internal LDO
    • Independent Power-on-Reset (RTC_PWRONRSTn) Input
    • Dedicated Input Pin (EXT_WAKEUP) for External Wake Events
    • Programmable Alarm Can be Used to Generate Internal Interrupts to the PRCM (for Wakeup) or Cortex-A8 (for Event Notification)
    • Programmable Alarm Can be Used With External Output (PMIC_POWER_EN) to Enable the Power Management IC to Restore Non-RTC Power Domains
  • Peripherals
    • Up to Two USB 2.0 High-Speed DRD (Dual-Role Device) Ports With Integrated PHY
    • Up to Two Industrial Gigabit Ethernet MACs (10, 100, 1000 Mbps)
      • Integrated Switch
      • Each MAC Supports MII, RMII, RGMII, and MDIO Interfaces
      • Ethernet MACs and Switch Can Operate Independent of Other Functions
      • IEEE 1588v1 Precision Time Protocol (PTP)
    • Up to Two Controller-Area Network (CAN) Ports
      • Supports CAN Version 2 Parts A and B
    • Up to Two Multichannel Audio Serial Ports (McASPs)
      • Transmit and Receive Clocks up to 50 MHz
      • Up to Four Serial Data Pins per McASP Port With Independent TX and RX Clocks
      • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
      • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
      • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Up to Six UARTs
      • All UARTs Support IrDA and CIR Modes
      • All UARTs Support RTS and CTS Flow Control
      • UART1 Supports Full Modem Control
    • Up to Two Master and Slave McSPI Serial Interfaces
      • Up to Two Chip Selects
      • Up to 48 MHz
    • Up to Three MMC, SD, SDIO Ports
      • 1-, 4- and 8-Bit MMC, SD, SDIO Modes
      • MMCSD0 has Dedicated Power Rail for 1.8‑V or 3.3-V Operation
      • Up to 48-MHz Data Transfer Rate
      • Supports Card Detect and Write Protect
      • Complies With MMC4.3, SD, SDIO 2.0 Specifications
    • Up to Three I2C Master and Slave Interfaces
      • Standard Mode (up to 100 kHz)
      • Fast Mode (up to 400 kHz)
    • Up to Four Banks of General-Purpose I/O (GPIO) Pins
      • 32 GPIO Pins per Bank (Multiplexed With Other Functional Pins)
      • GPIO Pins Can be Used as Interrupt Inputs (up to Two Interrupt Inputs per Bank)
    • Up to Three External DMA Event Inputs that can Also be Used as Interrupt Inputs
    • Eight 32-Bit General-Purpose Timers
      • DMTIMER1 is a 1-ms Timer Used for Operating System (OS) Ticks
      • DMTIMER4–DMTIMER7 are Pinned Out
    • One Watchdog Timer
    • SGX530 3D Graphics Engine
      • Tile-Based Architecture Delivering up to 20 Million Polygons per Second
      • Universal Scalable Shader Engine (USSE) is a Multithreaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Advanced Shader Feature Set in Excess of Microsoft VS3.0, PS3.0, and OGL2.0
      • Industry Standard API Support of Direct3D Mobile, OGL-ES 1.1 and 2.0, and OpenMax
      • Fine-Grained Task Switching, Load Balancing, and Power Management
      • Advanced Geometry DMA-Driven Operation for Minimum CPU Interaction
      • Programmable High-Quality Image Anti-Aliasing
      • Fully Virtualized Memory Addressing for OS Operation in a Unified Memory Architecture
    • LCD Controller
      • Up to 24-Bit Data Output; 8 Bits per Pixel (RGB)
      • Resolution up to 2048 × 2048 (With Maximum 126-MHz Pixel Clock)
      • Integrated LCD Interface Display Driver (LIDD) Controller
      • Integrated Raster Controller
      • Integrated DMA Engine to Pull Data from the External Frame Buffer Without Burdening the Processor via Interrupts or a Firmware Timer
      • 512-Word Deep Internal FIFO
      • Supported Display Types:
        • Character Displays - Uses LIDD Controller to Program these Displays
        • Passive Matrix LCD Displays - Uses LCD Raster Display Controller to Provide Timing and Data for Constant Graphics Refresh to a Passive Display
        • Active Matrix LCD Displays - Uses External Frame Buffer Space and the Internal DMA Engine to Drive Streaming Data to the Panel
    • 12-Bit Successive Approximation Register (SAR) ADC
      • 200K Samples per Second
      • Input can be Selected from any of the Eight Analog Inputs Multiplexed Through an 8:1 Analog Switch
      • Can be Configured to Operate as a 4-Wire, 5-Wire, or 8-Wire Resistive Touch Screen Controller (TSC) Interface
    • Up to Three 32-Bit eCAP Modules
      • Configurable as Three Capture Inputs or Three Auxiliary PWM Outputs
    • Up to Three Enhanced High-Resolution PWM Modules (eHRPWMs)
      • Dedicated 16-Bit Time-Base Counter With Time and Frequency Controls
      • Configurable as Six Single-Ended, Six Dual-Edge Symmetric, or Three Dual-Edge Asymmetric Outputs
    • Up to Three 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
  • Device Identification
    • Contains Electrical Fuse Farm (FuseFarm) of Which Some Bits are Factory Programmable
      • Production ID
      • Device Part Number (Unique JTAG ID)
      • Device Revision (Readable by Host ARM)
  • Debug Interface Support
    • JTAG and cJTAG for ARM (Cortex-A8 and PRCM), PRU-ICSS Debug
    • Supports Device Boundary Scan
    • Supports IEEE 1500
  • DMA
    • On-Chip Enhanced DMA Controller (EDMA) has Three Third-Party Transfer Controllers (TPTCs) and One Third-Party Channel Controller (TPCC), Which Supports up to 64 Programmable Logical Channels and Eight QDMA Channels. EDMA is Used for:
      • Transfers to and from On-Chip Memories
      • Transfers to and from External Storage (EMIF, GPMC, Slave Peripherals)
  • Inter-Processor Communication (IPC)
    • Integrates Hardware-Based Mailbox for IPC and Spinlock for Process Synchronization Between Cortex-A8, PRCM, and PRU-ICSS
      • Mailbox Registers that Generate Interrupts
        • Four Initiators (Cortex-A8, PRCM, PRU0, PRU1)
      • Spinlock has 128 Software-Assigned Lock Registers
  • Security
    • Crypto Hardware Accelerators (AES, SHA, RNG)
    • Secure Boot (optional; requires custom part engagement with TI)
  • Boot Modes
    • Boot Mode is Selected Through Boot Configuration Pins Latched on the Rising Edge of the PWRONRSTn Reset Input Pin
  • Packages:
    • 298-Pin S-PBGA-N298 Via Channel Package
      (ZCE Suffix), 0.65-mm Ball Pitch
    • 324-Pin S-PBGA-N324 Package
      (ZCZ Suffix), 0.80-mm Ball Pitch
  • Up to 1-GHz Sitara™ ARM® Cortex®-A8 32‑Bit RISC Processor
    • NEON™ SIMD Coprocessor
    • 32KB of L1 Instruction and 32KB of Data Cache With Single-Error Detection (Parity)
    • 256KB of L2 Cache With Error Correcting Code (ECC)
    • 176KB of On-Chip Boot ROM
    • 64KB of Dedicated RAM
    • Emulation and Debug - JTAG
    • Interrupt Controller (up to 128 Interrupt Requests)
  • On-Chip Memory (Shared L3 RAM)
    • 64KB of General-Purpose On-Chip Memory Controller (OCMC) RAM
    • Accessible to All Masters
    • Supports Retention for Fast Wakeup
  • External Memory Interfaces (EMIF)
    • mDDR(LPDDR), DDR2, DDR3, DDR3L Controller:
      • mDDR: 200-MHz Clock (400-MHz Data Rate)
      • DDR2: 266-MHz Clock (532-MHz Data Rate)
      • DDR3: 400-MHz Clock (800-MHz Data Rate)
      • DDR3L: 400-MHz Clock (800-MHz Data Rate)
      • 16-Bit Data Bus
      • 1GB of Total Addressable Space
      • Supports One x16 or Two x8 Memory Device Configurations
    • General-Purpose Memory Controller (GPMC)
      • Flexible 8-Bit and 16-Bit Asynchronous Memory Interface With up to Seven Chip Selects (NAND, NOR, Muxed-NOR, SRAM)
      • Uses BCH Code to Support 4-, 8-, or 16-Bit ECC
      • Uses Hamming Code to Support 1-Bit ECC
    • Error Locator Module (ELM)
      • Used in Conjunction With the GPMC to Locate Addresses of Data Errors from Syndrome Polynomials Generated Using a BCH Algorithm
      • Supports 4-, 8-, and 16-Bit per 512-Byte Block Error Location Based on BCH Algorithms
  • Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS)
    • Supports Protocols such as EtherCAT®, PROFIBUS, PROFINET, EtherNet/IP™, and More
    • Two Programmable Real-Time Units (PRUs)
      • 32-Bit Load/Store RISC Processor Capable of Running at 200 MHz
      • 8KB of Instruction RAM With Single-Error Detection (Parity)
      • 8KB of Data RAM With Single-Error Detection (Parity)
      • Single-Cycle 32-Bit Multiplier With 64-Bit Accumulator
      • Enhanced GPIO Module Provides Shift-In/Out Support and Parallel Latch on External Signal
    • 12KB of Shared RAM With Single-Error Detection (Parity)
    • Three 120-Byte Register Banks Accessible by Each PRU
    • Interrupt Controller (INTC) for Handling System Input Events
    • Local Interconnect Bus for Connecting Internal and External Masters to the Resources Inside the PRU-ICSS
    • Peripherals Inside the PRU-ICSS:
      • One UART Port With Flow Control Pins, Supports up to 12 Mbps
      • One Enhanced Capture (eCAP) Module
      • Two MII Ethernet Ports that Support Industrial Ethernet, such as EtherCAT
      • One MDIO Port
  • Power, Reset, and Clock Management (PRCM) Module
    • Controls the Entry and Exit of Stand-By and Deep-Sleep Modes
    • Responsible for Sleep Sequencing, Power Domain Switch-Off Sequencing, Wake-Up Sequencing, and Power Domain Switch-On Sequencing
    • Clocks
      • Integrated 15- to 35-MHz High-Frequency Oscillator Used to Generate a Reference Clock for Various System and Peripheral Clocks
      • Supports Individual Clock Enable and Disable Control for Subsystems and Peripherals to Facilitate Reduced Power Consumption
      • Five ADPLLs to Generate System Clocks (MPU Subsystem, DDR Interface, USB and Peripherals [MMC and SD, UART, SPI, I2C], L3, L4, Ethernet, GFX [SGX530], LCD Pixel Clock)
    • Power
      • Two Nonswitchable Power Domains (Real-Time Clock [RTC], Wake-Up Logic [WAKEUP])
      • Three Switchable Power Domains (MPU Subsystem [MPU], SGX530 [GFX], Peripherals and Infrastructure [PER])
      • Implements SmartReflex™ Class 2B for Core Voltage Scaling Based On Die Temperature, Process Variation, and Performance (Adaptive Voltage Scaling [AVS])
      • Dynamic Voltage Frequency Scaling (DVFS)
  • Real-Time Clock (RTC)
    • Real-Time Date (Day-Month-Year-Day of Week) and Time (Hours-Minutes-Seconds) Information
    • Internal 32.768-kHz Oscillator, RTC Logic and 1.1-V Internal LDO
    • Independent Power-on-Reset (RTC_PWRONRSTn) Input
    • Dedicated Input Pin (EXT_WAKEUP) for External Wake Events
    • Programmable Alarm Can be Used to Generate Internal Interrupts to the PRCM (for Wakeup) or Cortex-A8 (for Event Notification)
    • Programmable Alarm Can be Used With External Output (PMIC_POWER_EN) to Enable the Power Management IC to Restore Non-RTC Power Domains
  • Peripherals
    • Up to Two USB 2.0 High-Speed DRD (Dual-Role Device) Ports With Integrated PHY
    • Up to Two Industrial Gigabit Ethernet MACs (10, 100, 1000 Mbps)
      • Integrated Switch
      • Each MAC Supports MII, RMII, RGMII, and MDIO Interfaces
      • Ethernet MACs and Switch Can Operate Independent of Other Functions
      • IEEE 1588v1 Precision Time Protocol (PTP)
    • Up to Two Controller-Area Network (CAN) Ports
      • Supports CAN Version 2 Parts A and B
    • Up to Two Multichannel Audio Serial Ports (McASPs)
      • Transmit and Receive Clocks up to 50 MHz
      • Up to Four Serial Data Pins per McASP Port With Independent TX and RX Clocks
      • Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats
      • Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats)
      • FIFO Buffers for Transmit and Receive (256 Bytes)
    • Up to Six UARTs
      • All UARTs Support IrDA and CIR Modes
      • All UARTs Support RTS and CTS Flow Control
      • UART1 Supports Full Modem Control
    • Up to Two Master and Slave McSPI Serial Interfaces
      • Up to Two Chip Selects
      • Up to 48 MHz
    • Up to Three MMC, SD, SDIO Ports
      • 1-, 4- and 8-Bit MMC, SD, SDIO Modes
      • MMCSD0 has Dedicated Power Rail for 1.8‑V or 3.3-V Operation
      • Up to 48-MHz Data Transfer Rate
      • Supports Card Detect and Write Protect
      • Complies With MMC4.3, SD, SDIO 2.0 Specifications
    • Up to Three I2C Master and Slave Interfaces
      • Standard Mode (up to 100 kHz)
      • Fast Mode (up to 400 kHz)
    • Up to Four Banks of General-Purpose I/O (GPIO) Pins
      • 32 GPIO Pins per Bank (Multiplexed With Other Functional Pins)
      • GPIO Pins Can be Used as Interrupt Inputs (up to Two Interrupt Inputs per Bank)
    • Up to Three External DMA Event Inputs that can Also be Used as Interrupt Inputs
    • Eight 32-Bit General-Purpose Timers
      • DMTIMER1 is a 1-ms Timer Used for Operating System (OS) Ticks
      • DMTIMER4–DMTIMER7 are Pinned Out
    • One Watchdog Timer
    • SGX530 3D Graphics Engine
      • Tile-Based Architecture Delivering up to 20 Million Polygons per Second
      • Universal Scalable Shader Engine (USSE) is a Multithreaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Advanced Shader Feature Set in Excess of Microsoft VS3.0, PS3.0, and OGL2.0
      • Industry Standard API Support of Direct3D Mobile, OGL-ES 1.1 and 2.0, and OpenMax
      • Fine-Grained Task Switching, Load Balancing, and Power Management
      • Advanced Geometry DMA-Driven Operation for Minimum CPU Interaction
      • Programmable High-Quality Image Anti-Aliasing
      • Fully Virtualized Memory Addressing for OS Operation in a Unified Memory Architecture
    • LCD Controller
      • Up to 24-Bit Data Output; 8 Bits per Pixel (RGB)
      • Resolution up to 2048 × 2048 (With Maximum 126-MHz Pixel Clock)
      • Integrated LCD Interface Display Driver (LIDD) Controller
      • Integrated Raster Controller
      • Integrated DMA Engine to Pull Data from the External Frame Buffer Without Burdening the Processor via Interrupts or a Firmware Timer
      • 512-Word Deep Internal FIFO
      • Supported Display Types:
        • Character Displays - Uses LIDD Controller to Program these Displays
        • Passive Matrix LCD Displays - Uses LCD Raster Display Controller to Provide Timing and Data for Constant Graphics Refresh to a Passive Display
        • Active Matrix LCD Displays - Uses External Frame Buffer Space and the Internal DMA Engine to Drive Streaming Data to the Panel
    • 12-Bit Successive Approximation Register (SAR) ADC
      • 200K Samples per Second
      • Input can be Selected from any of the Eight Analog Inputs Multiplexed Through an 8:1 Analog Switch
      • Can be Configured to Operate as a 4-Wire, 5-Wire, or 8-Wire Resistive Touch Screen Controller (TSC) Interface
    • Up to Three 32-Bit eCAP Modules
      • Configurable as Three Capture Inputs or Three Auxiliary PWM Outputs
    • Up to Three Enhanced High-Resolution PWM Modules (eHRPWMs)
      • Dedicated 16-Bit Time-Base Counter With Time and Frequency Controls
      • Configurable as Six Single-Ended, Six Dual-Edge Symmetric, or Three Dual-Edge Asymmetric Outputs
    • Up to Three 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
  • Device Identification
    • Contains Electrical Fuse Farm (FuseFarm) of Which Some Bits are Factory Programmable
      • Production ID
      • Device Part Number (Unique JTAG ID)
      • Device Revision (Readable by Host ARM)
  • Debug Interface Support
    • JTAG and cJTAG for ARM (Cortex-A8 and PRCM), PRU-ICSS Debug
    • Supports Device Boundary Scan
    • Supports IEEE 1500
  • DMA
    • On-Chip Enhanced DMA Controller (EDMA) has Three Third-Party Transfer Controllers (TPTCs) and One Third-Party Channel Controller (TPCC), Which Supports up to 64 Programmable Logical Channels and Eight QDMA Channels. EDMA is Used for:
      • Transfers to and from On-Chip Memories
      • Transfers to and from External Storage (EMIF, GPMC, Slave Peripherals)
  • Inter-Processor Communication (IPC)
    • Integrates Hardware-Based Mailbox for IPC and Spinlock for Process Synchronization Between Cortex-A8, PRCM, and PRU-ICSS
      • Mailbox Registers that Generate Interrupts
        • Four Initiators (Cortex-A8, PRCM, PRU0, PRU1)
      • Spinlock has 128 Software-Assigned Lock Registers
  • Security
    • Crypto Hardware Accelerators (AES, SHA, RNG)
    • Secure Boot (optional; requires custom part engagement with TI)
  • Boot Modes
    • Boot Mode is Selected Through Boot Configuration Pins Latched on the Rising Edge of the PWRONRSTn Reset Input Pin
  • Packages:
    • 298-Pin S-PBGA-N298 Via Channel Package
      (ZCE Suffix), 0.65-mm Ball Pitch
    • 324-Pin S-PBGA-N324 Package
      (ZCZ Suffix), 0.80-mm Ball Pitch

The AM335x microprocessors, based on the ARM Cortex-A8 processor, are enhanced with image, graphics processing, peripherals and industrial interface options such as EtherCAT and PROFIBUS. The devices support high-level operating systems (HLOS). Processor SDK Linux® and TI-RTOS are available free of charge from TI.

The AM335x microprocessor contains the subsystems shown in the Functional Block Diagram and a brief description of each follows:

The contains the subsystems shown in the Functional Block Diagram and a brief description of each follows:

The microprocessor unit (MPU) subsystem is based on the ARM Cortex-A8 processor and the PowerVR SGX™ Graphics Accelerator subsystem provides 3D graphics acceleration to support display and gaming effects.

The PRU-ICSS is separate from the ARM core, allowing independent operation and clocking for greater efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces and real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others. Additionally, the programmable nature of the PRU-ICSS, along with its access to pins, events and all system-on-chip (SoC) resources, provides flexibility in implementing fast, real-time responses, specialized data handling operations, custom peripheral interfaces, and in offloading tasks from the other processor cores of SoC.

The AM335x microprocessors, based on the ARM Cortex-A8 processor, are enhanced with image, graphics processing, peripherals and industrial interface options such as EtherCAT and PROFIBUS. The devices support high-level operating systems (HLOS). Processor SDK Linux® and TI-RTOS are available free of charge from TI.

The AM335x microprocessor contains the subsystems shown in the Functional Block Diagram and a brief description of each follows:

The contains the subsystems shown in the Functional Block Diagram and a brief description of each follows:

The microprocessor unit (MPU) subsystem is based on the ARM Cortex-A8 processor and the PowerVR SGX™ Graphics Accelerator subsystem provides 3D graphics acceleration to support display and gaming effects.

The PRU-ICSS is separate from the ARM core, allowing independent operation and clocking for greater efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces and real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others. Additionally, the programmable nature of the PRU-ICSS, along with its access to pins, events and all system-on-chip (SoC) resources, provides flexibility in implementing fast, real-time responses, specialized data handling operations, custom peripheral interfaces, and in offloading tasks from the other processor cores of SoC.

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Technical documentation

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Type Title Date
* Data sheet AM335x Sitara™ Processors datasheet (Rev. L) PDF | HTML 15 Nov 2019
* Errata AM335x Sitara Processors Silicon Errata (Revs 2.1, 2.0, 1.0) (Rev. I) 03 Jan 2017
* User guide AM335x and AMIC110 Sitara™ Processors Technical Reference Manual (Rev. Q) 14 Feb 2023
Application note Industrial Communication Protocols Supported on Sitara™ Processors (Rev. E) PDF | HTML 10 May 2024
White paper Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) PDF | HTML 30 Apr 2024
Application note Enabling Matter on Sitara MPU 17 Jan 2024
White paper 確保 Arm 式應用處理器的安全 (Rev. E) 22 Nov 2023
White paper Securing Arm-Based Application Processors (Rev. E) 09 Nov 2023
Application note Intra Drive Communication Using 8b-10b Line Code With Programmable Real Time Uni PDF | HTML 24 May 2023
Application note High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 24 Feb 2023
Application note PRU-ICSS Feature Comparison (Rev. G) PDF | HTML 11 Oct 2022
White paper Industry 4.0 서보 드라이브에 Sitara™ 프로세서 및 마이크로컨트롤러 활용 (Rev. C) PDF | HTML 12 Jan 2022
White paper 運用適合工業 4.0 Sitara™ 伺服驅動器的處理器與微控制器 (Rev. C) PDF | HTML 12 Jan 2022
Design guide Discrete Power Solution for AM335x in 12mmx12mm Form-Factor Reference Design (Rev. A) PDF | HTML 09 Nov 2021
White paper Utilizing Sitara Processors and Microcontrollers for Industry 4.0 Servo Drives (Rev. C) 06 Oct 2021
Application note nfBGA Packaging (Rev. C) PDF | HTML 17 May 2021
Application note Ethernet PHY Configuration Using MDIO for Industrial Applications (Rev. A) 07 May 2021
More literature From Start to Finish: A Product Development Roadmap for Sitara™ Processors 16 Dec 2020
White paper EtherNet/IP on TI's Sitara AM335x Processors (Rev. D) 28 Jul 2020
User guide Powering the AM335x, AM437x, and AM438x with TPS65218D0 (Rev. B) 27 Feb 2020
Application note AM335x Schematic Checklist (Rev. A) PDF | HTML 19 Dec 2019
Application note AM335x EMIF Tools 20 Sep 2019
Application note AM335x PMIC Selection Guide (Rev. A) 19 Sep 2019
Application note Programmable Logic Controllers — Security Threats and Solutions PDF | HTML 13 Sep 2019
Product overview Sitara™ processors + WiLink™ 8 Wi-Fi® + Bluetooth® combo connectivity (Rev. A) 30 Jul 2019
White paper Power optimization techniques for energy-efficient systems (Rev. A) 28 Jun 2019
Application note Calculating Useful Lifetimes of Embedded Processors (Rev. B) PDF | HTML 07 May 2019
Application note AM335x Hardware Design Guide PDF | HTML 03 May 2019
Application note How to Port WOLFSSL Onto TI Sitara AM335 Starter Kit PDF | HTML 24 Apr 2019
User guide Powering AMIC110, AMIC120, AM335x, and AM437x with TPS65216 11 Apr 2019
EVM User's guide AM335x ICE EVM Rev2.1 Hardware User Guide 21 Feb 2019
Application note Common EOS pitfalls in board design 13 Feb 2019
Application note PRU-ICSS Getting Started Guide on TI-RTOS (Rev. A) 18 Jan 2019
Application note McASP Design Guide - Tips, Tricks, and Practical Examples 10 Jan 2019
Application note PRU Read Latencies (Rev. A) 21 Dec 2018
Application note PRU-ICSS Getting Starting Guide on Linux (Rev. A) 10 Dec 2018
White paper Ensuring real-time predictability (Rev. B) 04 Dec 2018
Application note PRU-ICSS EtherCAT Slave Troubleshooting Guide 07 Nov 2018
Application note PRU-ICSS / PRU_ICSSG Migration Guide 05 Nov 2018
White paper PROFINET on TI’s Sitara™ processors (Rev. D) 13 Oct 2018
White paper Secure Boot on embedded Sitara™ processors (Rev. A) 13 Oct 2018
User guide How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS 24 Sep 2018
White paper Smart grid leverages Arm®-based solutions to enable intelligent power (Rev. A) 19 Apr 2018
Application note HSR/PRP Solutions on Sitara Processors for Grid Substation Communication 17 Apr 2018
Application note Processor SDK RTOS Customization: Modifying Board library to change UART instanc (Rev. A) 28 Mar 2018
User guide Powering the AM335x With the TPS650250 (Rev. B) 14 Mar 2018
White paper Data concentrators: The core of energy and data management (Rev. A) 21 Feb 2018
User guide PRU Assembly Instruction User Guide 16 Feb 2018
White paper POWERLINK on TI Sitara Processors (Rev. A) 10 Jan 2018
Product overview TI Sitara™ AM335x ARM® Cortex™-A8 Microprocessors (Rev. E) 19 Dec 2017
User guide TPS65910Ax User's Guide for AM335x Processors (Rev. F) 08 Dec 2017
Technical article Introduction to EV charging displays PDF | HTML 15 Nov 2017
User guide Sub-1 GHz Sensor-to-Cloud Linux® E14 Kit 16 Oct 2017
Application note Thermal Design Guide for DSP and Arm Application Processors (Rev. B) 14 Aug 2017
Application note Processor-SDK RTOS Power Management and Measurement 02 Aug 2017
Application note Sitara Linux ALSA DSP Microphone Array Voice Recognition 30 Jun 2017
White paper Connected sensors in industrial automation (Rev. B) 22 Jun 2017
Application note AM335x Power Estimation Tool 31 May 2017
Application note AM335x Reliability Considerations in PLC Applications (Rev. A) 27 Apr 2017
Application note AM335x Low Power Design Guide (Rev. A) 28 Feb 2017
White paper Enable security and amp up chip performance w/ hardware-accelerated cryptograpy (Rev. A) 11 Aug 2016
Technical article How to select the right industrial Ethernet standard: EtherNet/IP PDF | HTML 25 Feb 2016
Technical article How to select the right industrial Ethernet standard: PROFINET PDF | HTML 06 Nov 2015
White paper Building automation for enhanced energy and operational efficiency (Rev. A) 26 Oct 2015
Application note Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 13 Aug 2015
Technical article How to select the right industrial Ethernet standard: Sercos III PDF | HTML 23 Jul 2015
White paper Profibus on AM335x and AM1810 Sitara ARM Microprocessor White Paper (Rev. B) 03 Mar 2015
User guide G3 Power Line Communication Data Concentrator on BeagleBone Black Design Guide 13 Nov 2014
User guide Powering the AM335x with the TPS65217x . (Rev. I) 06 Sep 2014
White paper Mainline Linux™ ensures stability and innovation 27 Mar 2014
White paper Linaro Speeds Development in TI Linux SDKs 27 Aug 2013
White paper The Yocto Project:Changing the way embedded Linux software solutions are develop 14 Mar 2013
White paper Smart thermostats are a cool addition to the connected home 27 Sep 2012
White paper Time Sensitive Networking for Industrial Automation (Rev. C) 31 Jul 0202

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