INA220-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified with the following results:
- Device Temperature Grade 1: –40°C to +125°C
Ambient Operating Temperature Range - Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C3B
- Device Temperature Grade 1: –40°C to +125°C
- High- or Low-Side Sensing
- Senses Bus Voltages from 0 V to 26 V
- Reports Current, Voltage, and Power
- 16 Programmable Addresses
- High Accuracy: 0.5% (Maximum) Over
Temperature - User-Programmable Calibration
- Fast (2.56-MHz) I2C- or SMBUS-Compatible
Interface - VSSOP-10 Package
The INA220-Q1 device is a current shunt and power monitor with an I2C- or SMBUS-compatible interface. The INA220-Q1 device monitors both shunt drop and supply voltage. A programmable calibration value, combined with an internal multiplier, enables direct readouts in amperes. An additional multiplying register calculates power in watts. The I2C- or SMBUS-compatible interface features 16 programmable addresses. The separate shunt input on the INA220-Q1 device allows it to be used in systems with low-side sensing.
The INA220-Q1 device senses across shunts on buses that can vary from 0 to 26 V, useful for low-side sensing or CPU power supplies. The device uses a single 3- to 5.5-V supply, drawing a maximum of 1 mA of supply current. The INA220-Q1 device operates from –40°C to +125°C.
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
SBOC297 — INA220EVM Rev A Software
支援產品和硬體
ANALOG-ENGINEER-CALC — PC software analog engineer's calculator
The analog engineer’s calculator is designed to speed up many of the repetitive calculations that analog circuit design engineers use on a regular basis. This PC-based tool provides a graphical interface with a list of various common calculations ranging from setting operational-amplifier (...)
支援產品和硬體
CS-AMPLIFIER-ERROR-TOOL — Current Sense Amplifier Comparison and Error Tool
支援產品和硬體
SBOR021 — Power Monitor Tool
支援產品和硬體
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| VSSOP (DGS) | 10 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點