SimpleLink™ 32-bit Arm Cortex-M4F multiprotocol 2.4 GHz wireless MCU with crystal-less BAW resonator
Product details
Parameters
Package | Pins | Size
Features
- Microcontroller
- Powerful 48-MHz Arm Cortex-M4F processor
- EEMBC CoreMark score: 148
- 352KB of in-system programmable flash
- 256KB of ROM for protocols and library functions
- 8KB of cache SRAM (alternatively available as general-purpose RAM)
- 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
- 2-pin cJTAG and JTAG debugging
- Supports over-the-air (OTA) update
- Ultra-low power sensor controller with 4KB of SRAM
- Sample, store, and process sensor data
- Operation independent from system CPU
- Fast wake-up for low-power operation
- TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
- RoHS-compliant package
- 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
- Peripherals
- Digital peripherals can be routed to any GPIO
- 4× 32-bit or 8× 16-bit general-purpose timers
- 12-bit ADC, 200 kSamples/s, 8 channels
- 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
- Programmable current source
- 2× UART
- 2× SSI (SPI, MICROWIRE, TI)
- I2C and I2S
- Real-time clock (RTC)
- AES 128- and 256-bit cryptographic accelerator
- ECC and RSA public key hardware accelerator
- SHA2 accelerator (full suite up to SHA-512)
- True random number generator (TRNG)
- Capacitive sensing, up to 8 channels
- Integrated temperature and battery monitor
- External system
- Integrated bulk acoustic wave (BAW) resonator generating accurate clock with fast startup time of 80 µs for system and RF
- On-chip buck DC/DC converter
- Low power
- Wide supply voltage range
- Normal operation: 1.8 to 3.8 V
- External regulator mode: 1.7 to 1.95 V
- Active mode RX: 7.3 mA
- Active mode TX 0 dBm: 7.9 mA
- Active mode TX 5 dBm: 10.2 mA
- Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 µA/MHz)
- Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.8 µA
- Sensor controller, active mode, 24 MHz, running infinite loop: 808 µA
- Standby: 0.94 µA (RTC on, 80KB RAM and CPU retention)
- Wide supply voltage range
- Radio section
- 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
- 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
- Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -102 dBm for Bluetooth 5 Low Energy Coded
- Programmable output power up to +5 dBm
- Suitable for systems targeting compliance with worldwide radio frequency regulations
- EN 300 328, (Europe)
- EN 300 440 Category 2
- FCC CFR47 Part 15
- ARIB STD-T66 (Japan)
- Wireless protocols
- Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
- Development Tools and Software
- CC2652RB LaunchPad™ Development Kit
- SimpleLink™ CC13x2 and CC26x2 Software Development Kit
- SmartRF™ Studio for simple radio configuration
- Sensor Controller Studio for building low-power sensing applications
All trademarks are the property of their respective owners.
Description
The SimpleLink™CC2652RB device is the industry’s first multiprotocol 2.4 GHz wireless crystal-less microcontroller (MCU) with integrated TI Bulk Acoustic Wave (BAW) resonator technology supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol operation through the Dynamic Multiprotocol Manager (DMM) software driver. Integrated BAW resonator technology eliminates the need for external crystals without compromising latency or frequency stability. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, power tool, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets.
The highlighted features of TI Bulk Acoustic Wave (BAW) resonator technology include:
- Unparalleled RF performance with high-performance frequency stability (±40 PPM) across temperature (-40°C to 85°C) and full operating voltage (1.8 V to 3.8 V), ultra-low jitter and phase noise to meet various wireless communication standards clock requirements.
- Efficient development and production cycles by eliminating crystal oscillator sourcing and reducing costly board re-designs and re-certification due to external crystal layout and assembly issues.
- Optimized Bill of Material (BOM) and PCB area savings (12% average).
- Superior long-term clock stability and aging performance (10 years) in comparison with most standard quartz crystal (longest 5 years aging) enables longer product lifecycles.
- Robust vibration and mechanical shock resistance (3× lower PPM variance versus external crystal) reduces product replacement costs from external crystal failure and allows for operation in harsh environments, such as in motors or heavy machinery.
- Mitigation of potential timing related side channel attacks from external clock tampering.
The highlighted features of the SimpleLink™ MCU platform include:
- Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK).
- Longer battery life wireless applications with low standby current of 0.84 µA and full RAM retention.
- Industrial temperature ready with lowest standby current of 5.6 µA at 85°C.
- Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
- Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
- Dedicated software-defined radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
The CC2652RB device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
Same functionality and pinout but is not an equivalent to the compared device:
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The SimpleLink™ Wi-Fi® CC3200 Audio BoosterPack enables the evaluation and development with the digital audio peripheral [I2S] present on the SimpleLink™ Wi-Fi® CC3200 device. It contains a Class-D power amplifier to drive speakers and an ultra-low power audio codec, TLV320AIC3254, supporting (...)
Features
- 1 Microphone
- 1 audio 3.5 mono jack
- 2 audio 3.5 mm stereo jack (in and out)
- Onboard speaker connector using terminal blocks (stereo)
- Onboard audio codec (TLV320AIC3254)
- Onboard class-D audio power amplifier (TPA2012D2)
Description
The Texas Instruments XDS110 EnergyTrace™ High Dynamic Range (ETHDR) is an accessory to the XDS110 Debug Probe (emulator) that increases the Dynamic Range of the Energy Trace feature. This allows performing very accurate power consumption measurements on all Simplelink Wireless MCUs while (...)
Features
The Texas Instruments XDS110 EnergyTrace™ High Dynamic Range (ETHDR) is the first accessory to the XDS110 Debug Probe (emulator). Designed to be a complete plug-in solution that brings EnergyTrace to the higher power wireless connectivity systems, it features an improved range, resolution and (...)
Description
The Texas Instruments XDS110 is a new class of debug probe (emulator) for TI embedded processors. The XDS110 replaces the XDS100 family while supporting a wider variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a single pod. Also, all XDS debug probes support Core and System Trace in all ARM and (...)
Features
The XDS110 is the latest entry level debug probe (emulators) for TI embedded processors. Designed to be a complete solution that delivers JTAG and SWD connectivity at a low cost, the XDS110 is the debug probe of choice for entry-level debugging of TI microcontrollers, processors and SimpleLink (...)
Description
The Spectrum Digital XDS200 is the first model of the XDS200 family of debug probes (emulators) for TI processors. The XDS200 family features a balance of low cost with good performance between the super low cost XDS110 and the high performance XDS560v2, while supporting a wide variety of standards (...)
Features
The XDS200 is the mid-range family of JTAG debug probes (emulators) for TI processors. Designed to deliver good performance and the most common features that place it between the low cost XDS110 and the high performance XDS560v2, the XDS200 is the balanced solution to debug TI microcontrollers (...)
Description
This LaunchPad™ is used to get started with the SimpleLink™ crystal-less BAW CC2652RB multiprotocol wireless MCU with support for Bluetooth®, Zigbee®, and Thread. Software support is provided by the CC13X2-CC26X2 software development kit (SDK).
Features
- All IOs accessible on pin headers compatible with the LaunchPad/BoosterPack eco system
- Connect your LaunchPad to the cloud with Bluetooth low energy on your Smartphone
- Upgrade the firmware for the LaunchPad development kit over-the-air from the SimpleLink Starter application
Software development
Features
- TI 15.4-Stack, an IEEE 802.15.4-based star topology networking solution for the Sub-1 GHz band (learn more at www.ti.com/LongRange)
- Supports development of proprietary Sub-1 GHz and 2.4 GHz applications using the RF driver and the EasyLink Abstraction Layer (learn more at www.ti.com/LongRange)
- TI (...)
Features
- TI Arm® Clang Compiler Tools release 1.1.0+STS:
- Improved compiler-generated code size vs. legacy TI compiler
- GCC-compatible compiler command-line interface
- Source-Based Code Coverage, including Branch Coverage
- With tiarmprofdata and tiarmcov utilities to help with visualization
- Support for Arm C Language (...)
Features
- Includes ready to use examples for several common use-cases
- Full toolchain with built-in compiler and assembler for programming in a C-like programming language
- Provides rapid development by using the integrated sensor controller task testing and debugging functionality including visualization of (...)
Features
The SimpleLink SDK plug-in for HomeKit applications provides a consistent API, across both Wi-Fi (IP) and Bluetooth™ Low Energy protocols, that supports these services:
- HomeKit Accessory Protocol (HAP)
- Security services: cipher, signing, key management
- Software or Hardware MFi Authentication
- (...)
SmartRF Flash Programmer can be used to program the flash memory in Texas Instruments 8051-based low-power RF wireless MCUs and for (...)
Features
- Programming of SW images on low-power RF wireless MCUs
- Programming/updating firmware and bootloader on the Evaluation Boards' USB MCU
- Append software image to existing software on device
- Read out software image from device into binary, hex or ELF files (elf and bin for ARM-devices only)
- Verify software (...)
CCS Uniflash is a standalone tool used to (...)
Design tools & simulation
Features
- Battery life estimator
- Use-case profile configurability
Features
- Range estimate spreadsheet for Sub-1 GHz and 2.4 GHz devices
- Range debug checklist
Features
- Link tests. Send and Receive packets between nodes.
- Antenna and radiation tests. Set the radio in continuous wave TX and RX states.
- A set of recommended/typical register settings for all devices.
- Read and write individual RF registers.
- Execute individual commands to control the radio.
- Detailed (...)
Features
- Power calculator for CC13X2 and CC26X2 products using the Z-Stack software from the SimpleLink CC13X2 and CC26X2 software development kit (SDK)
Reference designs
Design files
-
download TIDA-010012 BOM Files.zip (174KB) -
download TIDA-010012 Assembly Files.zip (356KB) -
download TIDA-010012 Layer Plots.zip (1706KB) -
download TIDA-010012 CAD Files.zip (5258KB) -
download TIDA-010012 Gerber.zip (1059KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
VQFN (RGZ) | 48 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
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