The OPA2313-Q1 dual-channel operational amplifier combines low power consumption with good performance. This enables it to be used in a wide range of applications, such as infotainment, engine control units, automotive lighting and more. The OPA2313-Q1 features rail-to-rail input and output (RRIO) swings, low quiescent current (50 µA, typical), wide bandwidth (1 MHz) and very low noise (25 nV/√Hz at 1 kHz), making it attractive for a variety of applications that require a good balance between cost and performance. Furthermore, low input bias current enables this device to be used in applications with megaohm source impedances.
The robust design of the OPA2313-Q1 provides ease-of-use to the circuit designer: unity-gain stability with capacitive loads of up to 150 pF, integrated RFI/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).
The device is optimized for operation at voltages as low as 1.8 V (±0.9 V) and up to 5.5 V (±2.75 V), and is specified over the extended temperature range of –40°C to +125°C.
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| Part number | Order | Number of channels (#) | Total supply voltage (Min) (+5V=5, +/-5V=10) | Total supply voltage (Max) (+5V=5, +/-5V=10) | GBW (Typ) (MHz) | Slew rate (Typ) (V/us) | Rail-to-rail | Vos (offset voltage @ 25 C) (Max) (mV) | Iq per channel (Typ) (mA) | Vn at 1 kHz (Typ) (nV/rtHz) | Rating | Operating temperature range (C) | Package Group | Package size: mm2:W x L (PKG) | Offset drift (Typ) (uV/C) | Features | Input bias current (Max) (pA) | CMRR (Typ) (dB) | Output current (Typ) (mA) | Architecture |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| OPA2313-Q1 |
|
2 | 1 | 0.5 |
In
Out |
2.5 | 0.05 | 25 | Automotive | -40 to 125 |
SOIC | 8
VSSOP | 8 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) |
2 |
EMI Hardened
Small Size |
10 | 80 | 15 | CMOS | ||
| TLV2313-Q1 |
|
2 | 1 | 0.5 |
In
Out |
3 | 0.065 | 26 | Automotive | -40 to 125 |
SOIC | 8
VSSOP | 8 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) |
2 |
Cost Optimized
EMI Hardened Small Size |
85 | 15 | CMOS | |||
| TLV6001-Q1 |
|
1 | 1.8 | 5.5 | 1 | 0.5 |
In
Out |
4.5 | 0.075 | 28 | Automotive | -40 to 125 | SC70 | 5 | 5SC70: 4 mm2: 2.1 x 2 (SC70 | 5) | 2 |
Cost Optimized
EMI Hardened Small Size |
76 | 76 | 15 | CMOS |
| TLV6002-Q1 |
|
2 | 1.8 | 5.5 | 1 | 0.5 |
In
Out |
4.5 | 0.075 | 28 | Automotive | -40 to 125 |
SOIC | 8
VSSOP | 8 |
8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8) |
2 |
Cost Optimized
EMI Hardened |
76 | 76 | 15 | CMOS |
