Product details

Sample rate (max) (Msps) 200 Resolution (Bits) 11 Number of input channels 1 Interface type Parallel CMOS, Parallel LVDS Analog input BW (MHz) 550 Features Low Power Rating Catalog Peak-to-peak input voltage range (V) 2 Power consumption (typ) (mW) 310 Architecture Pipeline SNR (dB) 66.3 ENOB (Bits) 10.6 SFDR (dB) 87.5 Operating temperature range (°C) -40 to 85 Input buffer Yes
Sample rate (max) (Msps) 200 Resolution (Bits) 11 Number of input channels 1 Interface type Parallel CMOS, Parallel LVDS Analog input BW (MHz) 550 Features Low Power Rating Catalog Peak-to-peak input voltage range (V) 2 Power consumption (typ) (mW) 310 Architecture Pipeline SNR (dB) 66.3 ENOB (Bits) 10.6 SFDR (dB) 87.5 Operating temperature range (°C) -40 to 85 Input buffer Yes
VQFN (RGZ) 48 49 mm² 7 x 7
  • ADS58B18: 11-Bit, 200MSPS
  • ADS58B19: 9-Bit, 250MSPS
  • Integrated High-Impedance Analog Input Buffer
  • Ultralow Power:
    • Analog Power: 258mW at 200MSPS
    • I/O Power: 69mW (DDR LVDS, low LVDS swing)
  • High Dynamic Performance:
    • ADS58B18: 66dBFS SNR and 81dBc SFDR at 150MHz
    • ADS58B19: 55.7dBFS SNR and 76dBc SFDR at 150MHz
  • Enhanced SNR Using TI-Proprietary SNRBoost Technology (ADS58B18 Only)
    • –77.7dBFS SNR in 20MHz Bandwidth
  • Dynamic Power Scaling with Sample Rate
  • Output Interface:
    • Double Data Rate (DDR) LVDS with Programmable Swing and Strength
      • Standard Swing: 350mV
      • Low Swing: 200mV
      • Default Strength: 100Ω Termination
      • 2x Strength: 50Ω Termination
    • 1.8V Parallel CMOS Interface Also Supported
  • Programmable Gain for SNR/SFDR Trade-Off
  • DC Offset Correction
  • Supports Low Input Clock Amplitude
  • Package: QFN-48 (7mm × 7mm)

PowerPAD is a trademark of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.

  • ADS58B18: 11-Bit, 200MSPS
  • ADS58B19: 9-Bit, 250MSPS
  • Integrated High-Impedance Analog Input Buffer
  • Ultralow Power:
    • Analog Power: 258mW at 200MSPS
    • I/O Power: 69mW (DDR LVDS, low LVDS swing)
  • High Dynamic Performance:
    • ADS58B18: 66dBFS SNR and 81dBc SFDR at 150MHz
    • ADS58B19: 55.7dBFS SNR and 76dBc SFDR at 150MHz
  • Enhanced SNR Using TI-Proprietary SNRBoost Technology (ADS58B18 Only)
    • –77.7dBFS SNR in 20MHz Bandwidth
  • Dynamic Power Scaling with Sample Rate
  • Output Interface:
    • Double Data Rate (DDR) LVDS with Programmable Swing and Strength
      • Standard Swing: 350mV
      • Low Swing: 200mV
      • Default Strength: 100Ω Termination
      • 2x Strength: 50Ω Termination
    • 1.8V Parallel CMOS Interface Also Supported
  • Programmable Gain for SNR/SFDR Trade-Off
  • DC Offset Correction
  • Supports Low Input Clock Amplitude
  • Package: QFN-48 (7mm × 7mm)

PowerPAD is a trademark of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.

The ADS58B18/B19 are members of the ultralow power ADS4xxx analog-to-digital converter (ADC) family that features integrated analog buffers and SNRBoost technology. The ADS58B18 and ADS58B19 are 11-bit and 9-bit ADCs with sampling rates up to 200MSPS and 250MSPS, respectively. Innovative design techniques are used to achieve high dynamic performance while consuming extremely low power. The analog input pins have buffers with constant performance and input impedance across a wide frequency range. This architecture makes these parts well-suited for multi-carrier, wide bandwidth communications applications such as PA linearization.

The ADS58B18 uses TI-proprietary SNRBoost technology that can be used to overcome SNR limitation as a result of quantization noise for bandwidths less than Nyquist (fS/2).

Both devices have gain options that can be used to improve SFDR performance at lower full-scale input ranges, especially at very high input frequencies. They also include a dc offset correction loop that can be used to cancel the ADC offset. At lower sampling rates, the ADC automatically operates at scaled-down power with no loss in performance.

These devices support both double data rate (DDR) low-voltage differential signaling (LVDS) and parallel CMOS digital output interfaces. The low data rate of the DDR LVDS interface (maximum 500Mbps) makes it possible to use low-cost field-programmable gate array (FPGA)-based receivers. They have a low-swing LVDS mode that can be used to further reduce the power consumption. The strength of the LVDS output buffers can also be increased to support 50Ω differential termination.

The ADS58B18/B19 are both available in a compact QFN-48 package and specified over the industrial temperature range (–40°C to +85°C).

The ADS58B18/B19 are members of the ultralow power ADS4xxx analog-to-digital converter (ADC) family that features integrated analog buffers and SNRBoost technology. The ADS58B18 and ADS58B19 are 11-bit and 9-bit ADCs with sampling rates up to 200MSPS and 250MSPS, respectively. Innovative design techniques are used to achieve high dynamic performance while consuming extremely low power. The analog input pins have buffers with constant performance and input impedance across a wide frequency range. This architecture makes these parts well-suited for multi-carrier, wide bandwidth communications applications such as PA linearization.

The ADS58B18 uses TI-proprietary SNRBoost technology that can be used to overcome SNR limitation as a result of quantization noise for bandwidths less than Nyquist (fS/2).

Both devices have gain options that can be used to improve SFDR performance at lower full-scale input ranges, especially at very high input frequencies. They also include a dc offset correction loop that can be used to cancel the ADC offset. At lower sampling rates, the ADC automatically operates at scaled-down power with no loss in performance.

These devices support both double data rate (DDR) low-voltage differential signaling (LVDS) and parallel CMOS digital output interfaces. The low data rate of the DDR LVDS interface (maximum 500Mbps) makes it possible to use low-cost field-programmable gate array (FPGA)-based receivers. They have a low-swing LVDS mode that can be used to further reduce the power consumption. The strength of the LVDS output buffers can also be increased to support 50Ω differential termination.

The ADS58B18/B19 are both available in a compact QFN-48 package and specified over the industrial temperature range (–40°C to +85°C).

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 10
Top documentation Type Title Format options Date
* Data sheet 11-Bit, 200MSPS/9-Bit, 250MSPS, Ultralow-Power ADCs with Analog Buffer datasheet (Rev. D) 28 Jan 2011
User guide Interfacing Altera FPGAs to ADS4249 and DAC3482 (TIDA-00069 Reference Guide) 10 Jul 2012
Application note High-Speed, Analog-to-Digital Converter Basics 11 Jan 2012
Application note Power Supply Design for the ADS41xx (Rev. A) 29 Dec 2011
Application note Driving High-Speed ADCs: Circuit Topologies and System-Level Parameters (Rev. A) 10 Sep 2010
Application note Smart Selection of ADC/DAC Enables Better Design of Software-Defined Radio 28 Apr 2009
Application note CDCE62005 as Clock Solution for High-Speed ADCs 04 Sep 2008
Application note CDCE72010 as a Clocking Solution for High-Speed Analog-to-Digital Converters 08 Jun 2008
Application note Phase Noise Performance and Jitter Cleaning Ability of CDCE72010 02 Jun 2008
Application note QFN Layout Guidelines 28 Jul 2006

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ADS58B18EVM — ADS58B18 11-Bit, 200-MSPS Analog-to-Digital Converter Evaluation Module

The ADS58B18EVM is a circuit board that allows designers to evaluate the performance of Texas Instruments‘ ADS58B18 device, an extremely low power 11-bit 200 MSPS analog to digital converter. The ADC features a buffered analog input and configurable parallel DDR LVDS or CMOS outputs. The EVM (...)

User guide: PDF | HTML
Not available on TI.com
GUI for evaluation module (EVM)

DATACONVERTERPRO-SW High Speed Data Converter Pro GUI Installer, v5.31

This high-speed data converter pro GUI is a PC (Windows® XP/7/10 compatible) program designed to aid in evaluation of most TI high-speed data converter [analog-to-digital converter (ADC) and digital-to-analog converter (DAC)] and analog front-end (AFE) platforms. Designed to support the entire (...)

Supported products & hardware

Supported products & hardware

GUI for evaluation module (EVM)

SLAC384 ADS41xx SPI GUI rev1.6

Supported products & hardware

Supported products & hardware

Simulation model

ADS414x, ADS412x, ADS58B1x, IBIS MODEL

SBAM091.ZIP (318 KB) - IBIS Model
Simulation model

ADS414x, ADS412x, ADS58B1x, IBIS MODEL (Rev. A)

SBAM091A.ZIP (318 KB) - IBIS Model
Bill of materials (BOM)

ADS41xx EVM BOM, Schematic, and PCB

SLAR048.ZIP (2222 KB)
Calculation tool

ANALOG-ENGINEER-CALC PC software analog engineer's calculator

The analog engineer’s calculator is designed to speed up many of the repetitive calculations that analog circuit design engineers use on a regular basis. This PC-based tool provides a graphical interface with a list of various common calculations ranging from setting operational-amplifier (...)

Supported products & hardware

Supported products & hardware

Calculation tool

JITTER-SNR-CALC Jitter and SNR calculator

JITTER-SNR-CALC can be used for calculating theoretical Signal to Noise (SNR) performance of ADCs based on input frequency and clock jitter.

Supported products & hardware

Supported products & hardware

Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins CAD symbols, footprints & 3D models
VQFN (RGZ) 48 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos